To reduce the cost of conductive fillers and improve their conductivity, composite conductive fillers are often used. Composite conductive fillers can be classified into composite powders and composite fibers according to their shape. Based on the core material, metal-coated composite powders can be divided into three types: metal-metal (e.g., Ag/Cu), metal-nonmetal (e.g., Cu/graphite), and metal-ceramic (e.g., Ag/SiO2). There are also metal oxide-coated composite powders.
Silver-plated solid glass microspheres (0.01–0.001 ohm-cm): The silver plating layer provides excellent adhesion to glass and meets the requirements of the US military for resistance to vibration and electromagnetic shock. Chemically inert, high-temperature stable, and does not experience a decrease in electrical conductivity due to oxidation over time and temperature. Low density-reducing weight-improves dispersibility and rheological properties of resin substrates. Used in the production of EMI silicone gaskets, adhesives, and paints.
Silver-plated hollow glass microspheres (0.1–0.01 ohm-cm): Provides excellent adhesion of silver to glass surfaces. Low density avoids particle sedimentation, improves dispersibility and resin matrix rheology. Used in the production of EMI silicone gaskets, adhesives, and paints.
Key Features: Acid and alkali resistance, excellent oxidation resistance; can replace pure silver powder, reducing costs.
Main Applications: Primarily used in superconducting silicone rubber, FIP conductive silicone rubber, conductive adhesives, and epoxy conductive adhesives.
